Top bond pad for transducing head interconnect
US7929248B2 · kind B2 · utility
22Cited by
25References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2006 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Aug 31, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4853
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A slider according to the present invention includes a slider body, a plurality of insulators, and conductive traces. The slider body has a first side and edges defined substantially perpendicular to the first side. The plurality of insulators are each adjacent to the first side of the slider body. The conductive traces are adjacent to each of the plurality of insulators and opposite the slider body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.