Measuring stresses in multi-layer thin film systems with variable film thickness
US7930113B1 · kind B1 · utility
6Cited by
13References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2008 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Dec 27, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/24
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems are described that include computer program products that enable data processing apparatus to perform operations to determine stresses for a system including a substrate with a plurality of films layered thereon. The operations include determining film stresses and system curvatures in terms of misfit strains and thicknesses the plurality of films, determining film stresses and interface shear stresses in terms of system curvature and the thicknesses of each film, and transmitting the film stresses and the interface shear stresses to a computer-readable medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.