High heat flux evaporator, heat transfer systems
US7931072B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2006 |
| Grant date | Apr 26, 2011 |
| Priority date | — |
| Expiry date | Oct 21, 2029 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2255/18
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An evaporator includes an outer fluid enclosure, a liquid inlet port extending through the outer fluid enclosure, a liquid-distribution structure, a wick, and a vapor removal channel. The liquid-distribution structure is joined to the outer fluid enclosure to form a fluidly sealed hermetic chamber. The liquid-distribution structure includes a vapor barrier wall having an outer heat-receiving surface and the liquid-distribution structure is configured to distribute liquid over an inner surface of the vapor barrier wall. The wick is positioned inside the fluidly sealed hermetic chamber and is coupled to a liquid inlet port. The vapor removal channel is defined by and is in fluid communication with the wick and the liquid-distribution structure, and is near the outer heat-receiving surface of the vapor barrier wall. A thermal conductance of the liquid-distribution structure is higher than a thermal conductance of the wick.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.