Method of teaching eyepoints for wire bonding and related semiconductor processing operations
US7931186B2 · kind B2 · utility
1Cited by
9References
21Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 13, 2007 |
| Grant date | Apr 26, 2011 |
| Priority date | — |
| Expiry date | Mar 13, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S228/904
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.