High-density, robust connector
US7931474B2 · kind B2 · utility
19Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2009 |
| Grant date | Apr 26, 2011 |
| Priority date | — |
| Expiry date | Aug 27, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6315
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high speed connector includes a plurality of wafer-style components, the wafers including two columns of conductive terminals that are supported in an insulative support body by a plurality of channels. Ribs may be provided to help secure one of the terminals in one of the plurality of channels. The two columns of terminals are configured to form broadside coupled terminal pairs and an air channel is at least partially disposed in the wafer between two adjacent broadside coupled terminal pairs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.