Method and apparatus for providing a substrate with viscous medium
US7931933B2 · kind B2 · utility
7Cited by
34References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2006 |
| Grant date | Apr 26, 2011 |
| Priority date | — |
| Expiry date | Nov 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Solder paste application, inspection and correction. Following or during application of solder paste on a substrate, the result thereof is inspected and any detected errors are registered. Following an evaluation as to whether correction of these errors is required and if it would be worthwhile, the errors are corrected. The correction involves removing solder paste from locations where so required, and jetting of additional solder paste to locations where so required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.