Photosensitive composition
US7932016B2 · kind B2 · utility
3Cited by
15References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2006 |
| Grant date | Apr 26, 2011 |
| Priority date | — |
| Expiry date | Nov 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.