Method of forming thin film patterning substrate including formation of banks
US7932518B2 · kind B2 · utility
60Cited by
7References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 17, 2008 |
| Grant date | Apr 26, 2011 |
| Priority date | — |
| Expiry date | Jun 24, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Display devices such as EL elements or LED elements, are formed from thin film elements having banks of prescribed height and a thin film layer formed by an ink jet method in areas to be coated that are partitioned by those banks. The banks may be formed of an organic material on a bank formation surface configured of an inorganic material, plasma treatment is performed under conditions that the induction gas is fluorine-based and that fluorine is present excessively, and the areas enclosed by the banks subjected to surface treatment are filled with the liquid thin film material to form the thin film layer or layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.