Multi-planar solid state amplifier
US7932781B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 7, 2009 |
| Grant date | Apr 26, 2011 |
| Priority date | — |
| Expiry date | May 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F3/19
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. The power amplifier modules and RF waveguide may be distributed about the heat spreader in different planes. Furthermore, the power amplifier modules may be located on opposite sides of the heat spreader and nonplanar to the waveguide split block. A method for dissipating heat within an SSPA may include receiving an RF signal in a first plane, amplifying the RF signal in another plane, and combining the RF signal in yet another plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.