Electronic device, electronic module, and methods for manufacturing the same
US7933128B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2008 |
| Grant date | Apr 26, 2011 |
| Priority date | — |
| Expiry date | Oct 20, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.