Method and system for teaching reference position of semiconductor wafer in automated wafer handling manufacturing equipment
US7933665B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2003 |
| Grant date | Apr 26, 2011 |
| Priority date | — |
| Expiry date | Aug 8, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
In order to automate the positioning at respective ports at the start-up of an equipment in a semiconductor manufacturing equipment equipped with a positioning device and a carrying robot and enhance productivity, 2 points W1 and W2 at which the circumference of a disc-like object 47 such as a wafer and the locus 43 of a detection means cross are detected, and the center position A of a disc-like object is calculated using the specific point O on the perpendicular bisector 42 of the section of a line combining 2 points with these and the radius r of the disc-like object. Thereby, the carrying robot could carry out the positioning work and not only the correction of a carrying route but also the reference position teaching at the start-up of equipment could be automated using the result.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.