Production method of an electronic circuit device
US7934312B2 · kind B2 · utility
2Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2009 |
| Grant date | May 3, 2011 |
| Priority date | — |
| Expiry date | Jan 9, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered therewith; a convex connector that has metal terminals for connection and is exposed from the resin-molded portion; and a sealing member wrapped around the resin-molded portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.