Ribbon bonding tool and process
US7934633B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2008 |
| Grant date | May 3, 2011 |
| Priority date | — |
| Expiry date | Apr 15, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2495
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.