Patent · US Active

Method of fabricating printhead assembly

US7935204B2 · kind B2 · utility

0Cited by

1References

11Claims

0Family size

Assignee

Silverbrook Research Pty Ltd · AU

Inventors

Seung Jin Lee · Suneung-ri, KR
Susan Williams · Sydney, AU
Jan Waszczuk · Sydney, AU
Kia Silverbrook · Sydney, AU

Key dates

Filing date	Dec 15, 2008
Grant date	May 3, 2011
Priority date	—
Expiry date	Sep 25, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49032
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.