Method of thermoforming
US7935301B2 · kind B2 · utility
2Cited by
50References
65Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2005 |
| Grant date | May 3, 2011 |
| Priority date | — |
| Expiry date | Feb 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3175
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of thermoforming comprises the steps of providing a film, heating the film, and forming the heated film onto a mold. The film comprises a propylene/ethylene copolymer skin layer having a melting point of from about 130° C. to about 150° C. and a interior polyamide layer having a melting point of from about 125° C. to about 230° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.