Electronic devices
US7935565B2 · kind B2 · utility
11Cited by
39References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2003 |
| Grant date | May 3, 2011 |
| Priority date | — |
| Expiry date | Nov 9, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/887
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for forming an electronic device having a multilayer structure, comprising: embossing a surface of a substrate so as to depress first and second regions of the substrate relative to at least a third region of the substrate; depositing conductive or semiconductive material from solution onto the first and second regions of the substrate so as to form a first electrode on the first region and a second electrode on the second region, wherein the electrodes are electrically insulated from each other by the third region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.