Light emitting diode module
US7935971B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2008 |
| Grant date | May 3, 2011 |
| Priority date | — |
| Expiry date | Dec 9, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a light emitting diode module capable of facilitating the connection between light emitting diode modules.The present invention provides a light emitting diode module including an insulating layer, a first circuit pattern layer and a second circuit pattern layer which are stacked on a top surface and a bottom surface of the insulating layer respectively and have one ends protruding to an outside of the insulating layer and the other ends positioned inside the insulating layer, a solder resist layer coated on the first circuit pattern layer, a first via formed vertically through a portion of the solder resist layer to be electrically connected to the first circuit pattern layer, a second via formed vertically through a portion of the solder resist layer and the insulating layer to be electrically connected to the second circuit pattern layer and a light emitting element mounted on the solder resist layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.