Wire bonding to connect electrodes
US7935979B2 · kind B2 · utility
9Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2008 |
| Grant date | May 3, 2011 |
| Priority date | — |
| Expiry date | Oct 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting apparatus includes a semiconductor layer having an electrode with two traces physically separated from one another. The light emitting apparatus further includes a wire bond electrically connecting the two traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.