Light emitting diode package

US7935981B2 · kind B2 · utility

Assignee

• LEXTAR ELECTRONICS CORPORATION · TW

Inventors

• Yu-Chun Lee · Hsinchu, TW
• Ya-Hsien Chang · Hsinchu, TW
• Cheng-Ta Kuo · Hsinchu, TW

Key dates

• Filing date: Jul 6, 2009
• Grant date: May 3, 2011
• Expiry date: Dec 7, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/49107

Abstract

A light emitting diode (LED) package includes a carrier, an LED chip, an encapsulant, a plurality of phosphor particles, and a plurality of anti-humidity particles. The LED chip is disposed on and electrically connected to the carrier. The encapsulant encapsulates the LED chip. The phosphor particles and the anti-humidity particles are distributed within the encapsulant. A first light emitted from the LED chip excites the phosphor particles to emit a second light. Some of the anti-humidity particles are adhered onto a surface of the phosphor particles, while the other anti-humidity particles are not adhered onto the surface of the phosphor particles. The anti-humidity particles absorb H2O so as to avoid H2O from being reacted with the phosphor particles. The LED package of the present application has favorable water resistance.