Patent · US Active

Classification of spatial patterns on wafer maps

US7937234B2 · kind B2 · utility

12Cited by

2References

18Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Eric St. Pierre · Chandler, US
Eugene Tuv · Chandler, US
Alexander Borisov · Nizhny Novgorod, RU

Key dates

Filing date	Aug 29, 2008
Grant date	May 3, 2011
Priority date	—
Expiry date	Jun 23, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Classification of spatial patterns on wafer maps is generally described. In one example, a method includes applying K-means type clustering to wafer maps comprising one or more spatial patterns to group one or more clusters comprising wafer maps having similar spatial patterns and producing a dendrogram using a clustering process to display the one or more clusters.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.