Dual hot melt adhesive systems
US7937908B2 · kind B2 · utility
4Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2008 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Nov 3, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S493/927
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to the use of first and second adhesives for the attachment of zipper flanges to reclosable packages. A first adhesive is typically a reactive, cross-linkable hot melt adhesive while the second adhesive is typically non-cross-linkable hot melt adhesive, typically, but not limited to, either EVA-based or polyamide-based. Alternatively, the second adhesive can be a coextrusion layer including a resin that is typically used as a sealant layer in zipper extrusion, such as metallocene type linear low density polyethylene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.