Method for bonding components made of material with a high silicic acid content
US7937968B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2005 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Oct 25, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C27/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
In a known method for bonding components made of material with a high silicic acid content by means of a substance to substance bond, a SiO2-containing bonding mass is formed between connecting surfaces of the components. In order to provide for cost-efficient manufacture of a thermally stable composite, the invention proposes to generate a SiO2-containing bonding mass that is generic with regard to the material with a high silicic acid content, comprising the following procedural steps: provision of a slurry containing amorphous SiO2 particles; formation of a slurry mass between the connecting surfaces which are fixed in position with regard to each other; drying of the slurry mass; and solidification of the slurry mass by heating under formation of the SiO2-containing bonding mass. A component assembly manufactured according to the method of the invention shows high temperature resistance and thermal fatigue resistance and can also be used in contamination-sensitive applications. The component assembly is characterized by an amorphous SiO2-containing bonding mass, whose chemical composition is generic with regard to the material with the high silicic acid content of the basic mat…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.