Annular aerosol jet deposition using an extended nozzle
US7938079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2004 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Jun 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/125
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for improved maskless deposition of electronic and biological materials using an extended nozzle. The process is capable of direct deposition of features with linewidths varying from a few microns to a fraction of a millimeter, and can be used to deposit features on targets with damage thresholds near 100° C. or less. Deposition and subsequent processing may be performed under ambient conditions and produce linewidths as low as 1 micron, with sub-micron edge definition. The extended nozzle reduces particle overspray and has a large working distance; that is, the orifice to target distance may be several millimeters or more, enabling direct write onto non-planar surfaces. The nozzle allows for deposition of features with linewidths that are approximately as small as one-twentieth the size of the nozzle orifice diameter, and is preferably interchangeable, enabling rapid variance of deposited linewidth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.