Method of transferring patterned non-densely packed interfacial particle films onto substrates
US7939133B2 · kind B2 · utility
1Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2007 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Feb 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/611
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A process for transferring patterned non-densely packed interfacial particle films onto substrates by providing a substrate, modifying the substrate so that it is non-water wetting, providing an interfacial film of charged particles, applying a surface modifying procedure to said particles, and applying the interfacial particle film to the modified substrate to thereby form a patterned non-densely packed film on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.