Resin composition
US7939167B2 · kind B2 · utility
7Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2009 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Dec 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24994
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a resin composition comprising a thermoplastic resin (A), an inorganic compound having a volume resistance of less than about 10−3 Ω·m and relative permeability of more than about 5,000 (B) and fiber filler (C). The resin composition of the present invention can have high impact strength and high electrical conductivity, and high electromagnetic interference (EMI) and radio frequency interference (RFI) shielding properties. The resin composition of the present invention can accordingly have multiple functions and can be used for electrical/electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.