Mask with registration marks and method of fabricating integrated circuits
US7939224B2 · kind B2 · utility
0Cited by
4References
24Claims
0Family size
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Key dates
| Filing date | Sep 14, 2007 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Aug 12, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/44
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photomask for a lithography apparatus includes a chip pattern configured to be transferred into a resist layer on a workpiece and at least one registration mark that is configured not to be transferred into the resist layer. Mask qualification may be improved without impacting wafer level processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.