Patent · US Active

Method of inhibiting background plating

US7939438B2 · kind B2 · utility

0Cited by
3References
10Claims
0Family size

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Inventors

Key dates

Filing dateMar 19, 2009
Grant dateMay 10, 2011
Priority date—
Expiry dateJul 22, 2029

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/50
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Methods of inhibiting background plating on semiconductor substrates using oxidizing agents are disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.