Preparation method for an electron tomography sample with embedded markers and a method for reconstructing a three-dimensional image
US7939906B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2009 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Dec 8, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31745
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A manufacturing method for an electron tomography specimen with embedded fiducial markers includes the following steps. A chip of wafer is provided. The chip includes at least one inspecting area. At least one trench is produced beside the inspecting area. A liquid with the markers is filled into the trenches. A first protection layer is coated on the chip, and then a second protection layer is deposited on the first protection layer. Therefore, the markers can be embedded into the electron tomography specimen. The embedded markers can improve the alignment process, due to those embedded markers are easily tracked during feature tracking procedure. In addition, our novel invention also successfully provides a modified version of the technique to deposit gold beads onto TEM pillar samples for much improved 3D reconstruction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.