Chip packages with covers
US7939918B2 · kind B2 · utility
1Cited by
48References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 26, 2006 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Feb 25, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
This invention discloses a crystalline substrate based device including a crystalline substrate having formed thereon a microstructure; and at least one packaging layer which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer. A method of producing a crystalline substrate based device is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.