Electronic device substrate, electronic device and methods for fabricating the same
US7939935B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 1, 2007 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Mar 11, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A core substrate-less electronic device is fabricated by using an electronic device substrate 10. The electronic device substrate 10 a metal core substrate 11, and an external connection wiring layer 100 provided on the metal core substrate 11, and an electronic parts-mounting layer 110 provided on the external connection wiring layer 100. The external connection wiring layer 100 has a first plating film 103 as an external connection terminal, and a PSR film 101 as an electrical insulating material. The electronic parts-mounting layer 110 has a conductive film 113 as an internal conductor pattern and a PSR film 111 as an electrical insulating material. A surface of the conductive film 113 is in a same plane as a surface of the PSR film 111.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.