Patent · US Active

Chip housing having reduced induced vibration

US7939937B2 · kind B2 · utility

5Cited by

1References

13Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Martin Holzmann · Gomaringen, DE
Frieder Haag · Wannweil, DE
Michael Knauss · Pfullingen, DE
Florian Grabmaier · Rötteln, DE

Key dates

Filing date	Mar 21, 2007
Grant date	May 10, 2011
Priority date	—
Expiry date	Aug 23, 2027

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2203/053
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.