Micromechanical Hf switching element and method for the production thereof
US7939993B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2005 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Jun 26, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49105
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a micromechanical HF switching element, in which a freestanding movable element is situated above a metallic surface on a substrate in such way that it is drawn to the metallic surface, to which a dielectric layer is applied, by applying an electrical voltage between the metallic surface and the movable element. The present invention also relates to a method for producing micromechanical HF switching elements of this type, in which the dielectric layer is deposited on the metal surface. The present method is distinguished in that a piezoelectric AlN layer having a columnar, polycrystalline structure and a texture is deposited on the metallic surface as the dielectric layer. Significantly reduced charging of the dielectric material and increased long-term stability of the switching element are achieved by the present method and the HF switching element thus produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.