Substrate with embedded signal line and ground planes with a slot therein

US7940144B2 · kind B2 · utility

Assignee

• EPCOS AG · DE

Inventors

• Robert Koch · Munich, DE
• Maximilian Pitschi · Rottach-Egern, DE
• Juergen Kiwitt · Munich, DE

Key dates

• Filing date: Mar 26, 2009
• Grant date: May 10, 2011
• Expiry date: Mar 26, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15313
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased.