Cover incorporating a radiofrequency identification device
US7940185B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2010 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Jul 15, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1039
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a multilayer structure such as a cover paper for a booklet, in particular a passport. The structure includes a radiofrequency identification device having a chip which is received in the thickness of the multilayer structure without generating extra thickness, the materials constituting the various layers of the multilayer structure are selected, as are the thicknesses of said layers, in such a manner that the cover withstands mechanical and thermal shocks, and in particular is capable of being subjected to graining treatment, and/or to decoration treatment by depositing a film by hot transfer under pressure, and/or to lamination treatment while depositing security films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.