Carrier unit of substrate transfer apparatus
US7942619B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2007 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Jun 8, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67775
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the present invention, a base 43 of a robot 27 is fixed to a fixing portion 53 of a frame divided body 50. The base 43 allows force exerted from a robot main body 27A to be transmitted to the fixing portion 53 of the frame divided body 50. Contrary, the fixing portion 53 of the frame divided body 50 has rigidity which can prevent the force exerted from the base 43 of the robot 27 from being transmitted to a main body constituting member 51. Accordingly, the base 43 of the robot 27 has only to possess a function for connecting the robot main body 27A and the frame divided body 50. Therefore, even though reducing its rigidity, transmission of vibration to the wafer processing apparatus can be prevented, as well as occurrence of malfunctioning in the substrate processing work can be prevented. In addition, increasing the rigidity of the frame divided body 50 can be achieved easier with a simpler construction and more effective than increasing the rigidity of the robot. Accordingly, more secured wafer processing can be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.