Method and device for monitoring thermal stress
US7942825B2 · kind B2 · utility
18Cited by
22References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2008 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Nov 18, 2029 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2560/0412
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method and device for monitoring thermal stress in a user is described. The device is designed to include a material having specific thermodynamic properties and physical dimensions defined as a function of those thermodynamic properties. A system for thermal stress monitoring including a thermal stress monitoring device configured within a garment is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.