Layered panel structure including self-bonded layers of thermoformable and non-thermoformable materials
US7943232B2 · kind B2 · utility
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2Claims
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Key dates
| Filing date | Jun 11, 2010 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Jun 11, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31645
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A layered panel structure including first and second layers formed, respectively, of (a) non-thermoformable, and (b) thermoformable, fiber-strand-reinforced resin, materials, having therebetween a bonding interface formed by resin drawn from the second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.