Semiconductor encapsulating epoxy resin composition and semiconductor device
US7943706B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2006 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Jul 31, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising(A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210,(B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and(C) an inorganic filler,the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.