Circuit board, its manufacturing method, and joint box using circuit board
US7943859B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2005 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Mar 10, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board with a simple structure is manufactured. A circuit board 19 has thereon a foil circuit 21 provided on a synthetic resin plate 20 formed by injection molding, made of a copper foil, and having a pattern different for circuit board 19. Anchor pins 20a projecting upward are provided on the resin plate 20 and passed through pinholes made in the foil circuit 21. The foil circuit 21 are positioned and secured to the resin plate 20. In a required portion of the resin plate 20, a terminal insertion hole 20c is provided, and receiving terminal 22 is secured to the required portion of the terminal insertion hole 20c and connected to the foil circuit 21.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.