Light emitting device package
US7943951B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2006 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Aug 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
Abstract
A light emitting device package is provided. The light emitting device package comprises a base substrate on which a wiring pattern is formed; a light emitting device mounted on the base substrate to emit light when supplied with driving power through the wiring pattern; a molded lens stably seated on the base substrate and having an inner space for sealing the light emitting device and reflective surfaces formed along outer sides facing the inner space to guide light from the light emitting device in an effective display direction; and a sealing resin between the inner space to bond the base substrate to the molded lens, whereby the packaging structure is simplified so that an assembly process and reliability testing are simplified, process losses due to defects are minimized, and the light extraction efficiency from the light emitting device and heat-dissipation performance are improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.