Patent · US Active

Housing for a power semiconductor module

US7944701B2 · kind B2 · utility

1Cited by

8References

6Claims

0Family size

Assignee

SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

Rainer Popp · Petersaurach, DE
Marco Lederer · Hirschaid, DE

Key dates

Filing date	Feb 13, 2008
Grant date	May 17, 2011
Priority date	—
Expiry date	Mar 9, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A housing for a power semiconductor module in which load-connecting elements having contact devices are arranged. The contact devices are arranged in housing troughs on the exterior of the housing. The housing troughs are formed at an associated lateral wall of the housing. The housing is closed off by a cover. The housing is preferably formed as a unitary piece of material having a circumferential sealing frame and the cover includes an outer rim that extends over the circumferential sealing frame, to prevent the penetration of fluid or moisture into the power semiconductor module when the cover is closed. On its inner rim, each housing trough includes a sealing rib formed of a section of the sealing frame. The associated load-connecting element is crimped about the sealing rib, so that the contact device is disposed within the trough.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.