Flash memory device assembly using adhesive
US7944703B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2008 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Nov 21, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A flash memory device includes one or two panels that are attached solely by a thermal bond adhesive to either a frame or integrated circuits (e.g., flash memory devices) disposed on a PCBA. The frame is disposed around the PCBA and supports peripheral edges of the panels. The thermal bond adhesive is either heat-activated or heat-cured, and is applied to either the memory devices, the frame or the panels, and then compressed between the panels and flash memory devices/frame using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. An optional insulating layer is disposed between the panels and the ICs. An optional conforming coating layer is formed over the ICs for preventing oxidation of integrated circuit leads or soldering area, covering or protecting extreme temperature exposure either cold or hot, and waterproofing for certain military or industrial applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.