Method and device for scan chain management of dies reused in a multi-chip package
US7945827B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 20, 2007 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Aug 15, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/318563
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for economical testing of dies in a multichip module. Internal I/O pins on a die are logically connected to external I/O pins of the multichip module through the use of a silicon interposer on which the dies are attached. Multiplexers on the interposer can select between the external pins of the multichip module and the internal pins of the dies. The silicon interposer can be economically manufactured using manufacturing technology having relatively a large feature size, such as is found in a relatively mature IC fabrication plant. Further, use of the present invention allows multichip modules to be tested for faults without the necessity of redesigning test circuitry or adding additional pins to the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.