Process for forming a plated film, and process for fabricating a magnetic device and perpendicular magnetic recording head
US7947434B2 · kind B2 · utility
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5References
9Claims
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Key dates
| Filing date | Feb 6, 2007 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Jul 31, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The process of forming a plated film according to the invention is designed such that the surface asperities of the inorganic film formed by the tracing of a standing wave occurring at the inner wall surface of the first opening in the resist at the resist pattern-formation step are reduced or eliminated. It is thus possible to form, efficiently yet in a short period of time, a high aspect-ratio plated film portion having an aspect ratio of greater than 1. In addition, the formed plated film quality is extremely improved for the absence of pores (cavities).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.