Process for forming encapsulated electronic devices

US7947536B2 · kind B2 · utility

Assignee

• E.I. DU PONT DE NEMOURS AND COMPANY · US

Inventors

• Nigel Morton Coe · Lompoc, US
• Kyle D. Frischknecht · Livermore, US
• Charles D. Lang · Wysox, US
• Matthew Stainer · Phoenix, US
• Raymond S. Pflanzer · Lompoc, US

Key dates

• Filing date: Nov 26, 2008
• Grant date: May 24, 2011
• Expiry date: Nov 26, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K50/8426

Abstract

There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.