Laser machining
US7947575B2 · kind B2 · utility
8Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2007 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Dec 10, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/3576
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of laser machining a feature in a substrate includes machining the substrate with a pulsed laser along a scan line so that the successive pulses 81 at the substrate do not overlap but are either contiguous or spaced apart. Pulses 82, 83, 84 in respective succeeding scans of the laser along the scan line, are offset with respect to the starting point of pulses 81, 82, 83 in a previous scan so that multiple successive laser scans provide machining to a required depth while successively smoothing edges, 91, 92, 93, 94 of the feature with each pass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.