Moisture activated latent curing adhesive or sealant
US7947758B2 · kind B2 · utility
4Cited by
18References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2006 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Jun 16, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L79/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a novel poly(ethylene oxide)imine; a novel amine reactive moiety; a novel moisture activated latent curing adhesive or sealant mixture comprising (1) a ketimine or aldimine, and (2) an amine reactive moiety; and a novel moisture activated latent curing adhesive or sealant comprising the reaction product of (1) and (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.