Patent · US Active

LED-based light module package including a ceramic layer and a light sensor

US7947947B2 · kind B2 · utility

11Cited by

5References

9Claims

0Family size

Assignee

KONINKLIJKE PHILIPS ELECTRONICS NV · NL

Inventors

Bernd Ackermann · Aachen, DE
Hans-Helmut Bechtel · Roetgen, DE
Achim Hilgers · Alsdorf, DE
Matthias Wendt · Neu-Anspach, DE

Key dates

Filing date	Sep 20, 2007
Grant date	May 24, 2011
Priority date	—
Expiry date	Mar 4, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/8514
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed is a light module package including a mounting substrate for mounting and electrically contacting at least one light emitting diode and a ceramic layer disposed in a path of light emitted by the light emitting diode. The ceramic layer includes a wavelength converting material and the light emitting diode is disposed between the ceramic layer and the mounting substrate. The light module package also includes a light sensor disposed at the mounting substrate for detecting a luminous output of the light emitting diode in order to control the brightness and/or the color of the light leaving the light module. The ceramic layer is only partly translucent to shield the light sensor against ambient light.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.