Capillary-flow underfill compositions, packages containing same, and systems containing same
US7948090B2 · kind B2 · utility
19Cited by
10References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2006 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Aug 27, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer and a hardener and allowing the underfill composition to flow between the integrated circuit die and the mounting substrate. An article is achieved by the method. The article can be assembled into a computing system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.