Portable electronic device incorporating extendable thermal module
US7948750B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2009 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Oct 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.